Advanced Micro Devices (AMD) has released a U.S. patent application for a new device design that incorporates high-bandwidth interconnects between processing elements.
According to the announcement, the new GPU chiplet design links processing elements via a high-speed electrical interface, called a crosslink. The design employs such crosslinks across memory, allowing faster access to cache levels.
The announcement notes that chiplet designs are increasingly seen as a way to address the parallel nature of graphics processing as well as skyrocketing performance requirements.
Comments